Senior FOL Process Engineer (Wire Bond & Die Attach)
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II-VI UK, Ltd.
Ipoh
Ipoh, Malaysia Hot Job Job Description JOB RESPONSIBILITIES: - Responsible for sustaining & improving the Die Attach & Wire Bond Process - Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production. - Monitor and maintain Assembly yield within KPI target. - Key involvement in... |
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3 days ago
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